| Basic Information | ||
| Supported CPU | 11th Generation Intel Core i9 processors / Intel Core i7 processors / Intel Core i5 processors 10th Generation Intel Core i9 processors / Intel Core i7 processors / Intel Core i5 processors / Intel Core i3 processors/ Intel Pentium processors / Intel Celeron processors L3 cache varies with CPU |
|
| Chipset | Intel B560 Express Chipset |
|
| BIOS | 1 x 256 Mbit flash Use of licensed AMI UEFI BIOS PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0 |
|
| Form Factor | Micro ATX Form Factor; 24.4cm x 24.4cm | |
| Expansion Slots | ||
| PCI | 1 x PCI Express x16 slot, running at x16 (PCIEX16) 1 x PCI Express x16 slot, running at x4 (PCIEX4) 1 x PCI Express x1 slot |
|
| M.2 Socket | 1 x M.2 connector (Socket 3, M key, type 2260/2280 PCIe 4.0 x4/x2 SSD support) (M2P_CPU) 1 x M.2 connector on the back of the motherboard (Socket 3, M key, type 2260/2280/22110 SATA and PCIe 3.0 x4/x2 SSD support) (M2A_SB) |
|
| Memory | ||
| Type | DDR4 | |
| Slots | 4 x DIMM | |
| Supported Memory | 11th Generation Intel Core i9/ i7/ i5 processors: Support for DDR4 5333(O.C.)/ DDR4 5133(O.C.)/ DDR4 5000(O.C.)/ 4933(O.C.)/ 4800(O.C.)/ 4700(O.C.)/ 4600(O.C.)/ 4500(O.C.)/ 4400(O.C.)/ 4300(O.C.)/ 4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3666(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200 / 3000 / 2933 / 2800 / 2666 / 2400 / 2133 MHz memory modules 10th Generation Intel Core i9/ i7 processors: Support for DDR4 2933/ 2666/ 2400/ 2133 MHz memory modules 10th Generation Intel Core i5/ i3 /Pentium/Celeron processors: Support for DDR4 2666/2400/2133 MHz memory modules Dual channel memory architecture Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode) Support for non-ECC Un-buffered DIMM 1Rx8/ 2Rx8/ 1Rx16 memory modules Support for Extreme Memory Profile (XMP) memory modules |
|
| Maximum Memory | 128 GB (32 GB single DIMM capacity) | |
| Graphics | ||
| Graphics | Integrated Graphics Processor-Intel® HD Graphics support: 1 x HDMI port, supporting a maximum resolution of 4096x2160@30 Hz 1 x DisplayPort, supporting a maximum resolution of 4096x2304@60 Hz Support for AMD Quad-GPU CrossFire and 2-Way AMD CrossFire technologies |
|
| Connector & Ports | ||
| HDMI | 1 x HDMI port, supporting a maximum resolution of 4096 x 2160@30 Hz | |
| USB (s) | 1 x USB Type-C port on the back panel, with USB 3.2 Gen2x2 support 1 x USB 3.2 Gen2 Type-A ports (red) on the back panel 2 x USB 3.2 Gen1 ports on the back panel 2 x USB 2.0/1.1 ports on the back panel Chipset+USB 3.2 Gen 1 Hub: 1 x USB Type-C port with USB 3.2 Gen1 support, available through the internal USB header 2 x USB 3.2 Gen1 ports available through the internal USB header Chipset+ 2 USB 2.0 Hubs: 8 x USB 2.0/ 1.1 ports (4 ports on the back panel, 4 ports available through the internal USB headers) |
|
| LAN Port (s) | Intel 2.5GbE LAN chip (2.5 Gbit/1 Gbit/100 Mbit) | |
| Supported Storage | 1 x M.2 connector (Socket 3, M key, type 2260/2280 PCIe 4.0 x4/x2 SSD support) (M2P_CPU) Chipset: 1 x M.2 connector on the back of the motherboard (Socket 3, M key, type 2260/2280/22110 SATA and PCIe 3.0 x4/x2 SSD support) (M2A_SB) 6 x SATA 6Gb/s connectors Intel Optane Memory Ready |
|
| Audio | Realtek Audio codec High Definition Audio 2/4/5.1/7.1-channel |
|
| Internal I/O Ports | 1 x 24-pin ATX main power connector 1 x 8-pin ATX 12V power connector 1 x CPU fan header 1 x water cooling CPU fan header 3 x system fan headers 2 x addressable LED strip headers 2 x RGB LED strip headers 6 x SATA 6Gb/s connectors 2 x M.2 Socket 3 connectors 1 x front panel header 1 x front panel audio header 1 x USB Type-C header, with USB 3.2 Gen 1 support 1 x USB 3.2 Gen 1 header 2 x USB 2.0/1.1 headers 2 x Thunderbolt add-in card connectors 1 x serial port header 1 x Clear CMOS jumper 1 x Q-Flash Plus button |
|
| Display Port (s) | 1 x DisplayPort, supporting a maximum resolution of 4096 x 2304@60 Hz | |
| TPM (Trusted Platform Module ) | 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only) |
|
| Others | ||
| Special Features | Wireless Communication module: Intel Wi-Fi 6 AX200 Wi-Fi 802.11a/ b/ g/ n/ ac/ ax, supporting 2.4/ 5 GHz Dual-Band BLUETOOTH 5.1 Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate |
|
| Warranty Information | ||
| Warranty | 3 Years |
|
The GIGABYTE B560M AORUS PRO AX Motherboard Uses 12 + 1 Phase Digital CPU Power Design Including Digital PWM Controller And DrMOS, These 100% Digital Controllers And 8 Additional Solid Pin -CPU Power Connectors Deliver Incredible Precision In Shipping AORUS PRO AX WiFi 11th Generation Motherboard B560M The AORUS Motherboard Uses A High Performance, Fully Covered Thermal Design With High Coverage MOSFET Heat Sinks And Thick Thermal Pad, Offering The Best Cooling Performance MOSFETs For The Enthusiast , Overclockers And Gamers. With The Highest Quality Components And The GIGABYTE RandD Design Features, The B560M AORUS Is A Real Beast Among Motherboards. It Offers High Quality Sound Resolution And Sound Enhancement To Achieve The Most Realistic Effects. Sound For Professional Gamers. The Motherboard Features Via RG B FUSION 2.0, Giving Users The Option To Control Onboard, External N Light Strips And / Or AORUS Devices With Addressable RGB / RGB LEDs To Make Your PC More Unique And Stylish. GIGABYTE Is Known For Its Product Shelf Life And High Quality Manufacturing Process. That Said, We Use The Best Components We Can Find For The B560M AORUS Motherboard, And We Reinforce Each Slot So That Each Is Solid And Durable. Good Software Goes Hand In Hand With Perfect Hardware.The GIGABYTE Motherboard Included Several Useful And Intuitive Pieces Of Software That Allow Users To Control All Aspects Of The Motherboard.
See More Motherboard
Get specific details about this product from customers who own it.