| BASIC INFORMATION | ||
| BIOS | 1 x 256 Mbit flash Use of licensed AMI UEFI BIOS PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0 |
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| Form Factor | ATX Form Factor; 30.5cm x 24.4cm | |
| Basic Information | ||
| Chipset | AMD B550 | |
| Audio | Realtek ALC1220-VB codec High Definition Audio 2/4/5.1/7.1-channel Support for S/PDIF Out |
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| CPU | AMD Ryzen 5000/4000G Series & AMD Ryzen 3rd Generation Processors | |
| Memory | ||
| Memory | Type: Dual-Channel Architecture Slots: 4 x DDR4 memory slots Supported Memory: 3rd Gen AMD Ryzen Processors: Support for DDR4 5200(O.C.) / 5000(O.C.) / 4866(O.C.) / 4600(O.C.) / 4400(O.C.) / 4000(O.C.) / 3600(O.C.) / 3333(O.C.) /3200/2933/2667/2400/2133 MHz memory modules New Generation AMD Ryzen™ with Radeon™ Graphics processors: Support for DDR4 5400(O.C.) / 5200(O.C.) / 5000(O.C.) / 4866(O.C.) / 4600(O.C.) / 4400(O.C.) / 4000(O.C.) / 3600(O.C.) / 3333(O.C.) /3200 /2933 /2667 /2400 /2133 MHz memory modules Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules Support for Extreme Memory Profile (XMP) memory modules Maximum Memory: support up to 128GB |
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| Storage | 1 x M.2 connector (M2A_CPU), integrated in the CPU, supporting Socket 3, M key, type 2242/2260/2280/22110 SSDs: 3rd Generation AMD Ryzen processors support SATA and PCIe 4.0 x4/x2 SSDs New Generation AMD Ryzen with Radeon Graphics processors support SATA and PCIe 3.0 x4/x2 SSDs 1 x M.2 connector (M2B_SB), integrated in the Chipset, supporting Socket 3, M key, type 2242/2260/2280/22110 SSDs: Support PCIe 3.0 x4/x2 SSDs 6 x SATA 6Gb/s connectors, integrated in the Chipset: Support for RAID 0, RAID 1, and RAID 10 |
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| Graphics | ||
| Graphics | Graphics: Integrated in the New Generation AMD Ryzen with Radeon Graphics processors: 1 x HDMI port, supporting a maximum resolution of 4096x2160@60 Hz Max Shared Memory: 16 GB |
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| Connector & Ports | ||
| HDMI | 1 x HDMI port, supporting a maximum resolution of 4096x2160@60 Hz | |
| LAN | Realtek 2.5GbE LAN chip (2.5 Gbit/1 Gbit/100 Mbit) Wireless Communication module: Intel Wi-Fi 3168 WIFI 802.11a/b/g/n/ac, supporting 2.4/5 GHz Dual-Band BLUETOOTH 4.2 Support for 11ac wireless standard and up to 433 Mbps data rate |
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| Internal I/O Ports | 1 x 24-pin ATX main power connector 1 x 8-pin ATX 12V power connector 2 x M.2 Socket 3 connectors 6 x SATA 6Gb/s connectors 1 x CPU fan header 1 x water cooling CPU fan header 4 x system fan headers 2 x system fan/water cooling pump headers 1 x CPU cooler LED strip/RGB LED strip header 2 x addressable LED strip headers 2 x RGB LED strip headers 1 x front panel header 1 x front panel audio header 1 x USB 3.2 Gen 1 header 2 x USB 2.0/1.1 headers 2 x temperature sensor headers 1 x Clear CMOS jumper 1 x Thunderbolt header |
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| USB Port | CPU: 3 x USB 3.2 Gen 1 ports on the back panel 1 x USB 3.2 Gen 2 Type-A port (red) on the back panel Chipset: 1 x USB Type-C™ port on the back panel, with USB 3.2 Gen 2 support 1 x USB 3.2 Gen 2 Type-A port (red) on the back panel 2 x USB 3.2 Gen 1 ports available through the internal USB header 2 x USB 2.0/1.1 ports on the back panel Chipset+2 USB 2.0 Hubs: 8 x USB 2.0/1.1 ports (4 ports on the back panel, 4 ports available through the internal USB headers) |
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| WARRANTY INFORMATION | ||
| Manufacturing Warranty | 03 years warranty | |
To fully support the latest 3rd Gen AMD Ryzen™ processors, B550 motherboards equip with the ultimate power solution which is true direct, digital and multiple phases. After countless experiments and testing, GIGABYTE presents the unbeatable B550 motherboards for enthusiast. No Compromise and never stop to achieve higher. B550 AORUS PRO motherboard uses an True 12+2 phases digital power design which includes PWM controller, doublers and DrMOS. These 100% digital controller offer incredible precision in delivering power to the motherboard's most power-hungry and energy-sensitive components, allowing enthusiasts to get the absolute maximum performance from 3rd Gen AMD Ryzen processors. GIGABYTE's exclusive 2X Copper PCBs design provides sufficient power trace paths between components to handle greater than normal power loads and to remove heat from the critical CPU power delivery area. This is essential to ensure the motherboard is able to handle the increased power loading that is necessary when overclocking.GIGABYTE realize that customer won't stop chasing a better computing performance. We take care of it and implement on products. Protective and optimized memory trace enhance the performance. Faster read and write are needed to save time and improve efficiency. We offer plenty of M.2 storage with thermal guards to ensure unthrottled read and write. In advance, adopting PCIe 4.0 ready components get the B550 motherboards easier to upgrade. AORUS is offering a tested and proven platform that ensures proper compatibility with profiles up to 5400MHz and beyond. All users need to do to attain this performance boost is to ensure that their memory module is XMP capable and that the XMP function is activated and enabled on their AORUS motherboard.
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