| BASIC INFORMATION | ||
| BIOS | 1 x 256 Mbit flash Use of licensed AMI UEFI BIOS PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0 |
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| Form Factor | ATX Form Factor; 30.5cm x 24.4cm | |
| Basic Information | ||
| Chipset | Intel B560 Express Chipset | |
| Audio | Realtek ALC4080 codec High Definition Audio 2/4/5.1/7.1-channel Support for S/PDIF Out |
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| CPU | 11th Generation Intel Core i9 processors / Intel Core i7 processors / Intel Core i5 processors 10th Generation Intel Core i9 processors / Intel Core i7 processors / Intel Core i5 processors / Intel Core i3 processors/ Intel Pentium processors / Intel Celeron processors L3 cache varies with CPU |
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| Memory | ||
| Memory | Type: DDR4 Slots: 4 x DIMM Supported Memory: 11th Generation Intel Core i9/ i7/ i5 processors: Support for DDR4 5333(O.C.)/ DDR4 5133(O.C.)/ DDR4 5000(O.C.)/ 4933(O.C.)/ 4800(O.C.)/ 4700(O.C.)/ 4600(O.C.)/ 4500(O.C.)/ 4400(O.C.)/ 4300(O.C.)/ 4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3666(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200 / 3000 / 2933 / 2800 / 2666 / 2400 / 2133 MHz memory modules 10th Generation Intel Core i9/ i7 processors: Support for DDR4 2933/ 2666/ 2400/ 2133 MHz memory modules 10th Generation Intel Core i5/ i3 /Pentium/Celeron processors: Support for DDR4 2666/2400/2133 MHz memory modules Dual channel memory architecture Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode) Support for non-ECC Un-buffered DIMM 1Rx8/ 2Rx8/ 1Rx16 memory modules Support for Extreme Memory Profile (XMP) memory modules Maximum Memory: 128 GB (32 GB single DIMM capacity) |
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| Storage | 1 x M.2 connector (Socket 3, M key, type 2260/ 2280/ 22110 PCIe 4.0 x4/ x2 SSD support) (M2P_CPU) Chipset: 1 x M.2 connector (Socket 3, M key, type 2260/ 2280/ 22110 SATA and PCIe 3.0 x4/x2 SSD support)(M2A_SB) 1 x M.2 connector (Socket 3, M key, type 2260/ 2280/ 22110 PCIe 3.0 x4/ x2 SSD support) (M2B_SB) 6 x SATA 6Gb/s connectors Intel Optane Memory Ready |
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| Graphics | ||
| Graphics | Integrated Graphics Processor-Intel HD Graphics support: 1 x DisplayPort, supporting a maximum resolution of 4096 x 2304 @60 Hz 1 x HDMI port, supporting a maximum resolution of 4096 x 2160 @30 Hz Support for AMD Quad-GPU CrossFire and 2-Way AMD CrossFire technologies |
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| Connector & Ports | ||
| HDMI | 1 x HDMI port, supporting a maximum resolution of 4096 x 2160@30 Hz | |
| LAN | Intel 2.5GbE LAN chip (2.5 Gbit/ 1 Gbit/ 100 Mbit) | |
| Internal I/O Ports | 1 x 24-pin ATX main power connector 1 x 8-pin ATX 12V power connector 1 x CPU fan header 1 x water cooling CPU fan header 3 x system fan headers 2 x addressable LED strip headers 2 x RGB LED strip headers 3 x M.2 Socket 3 connectors 6 x SATA 6Gb/s connectors 1 x front panel header 1 x front panel audio header 1 x USB Type-C header, with USB 3.2 Gen 1 support 1 x USB 3.2 Gen 1 header 2 x USB 2.0/1.1 headers 1 x S/PDIF Out header 2 x Thunderbolt add-in card connectors 1 x Clear CMOS jumper 1 x Q-Flash Plus button |
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| USB Port | 1 x USB Type-C port on the back panel, with USB 3.2 Gen 2x2 support 1 x USB Type-C port with USB 3.2 Gen 1 support, available through the internal USB header 1 x USB 3.2 Gen 2 Type-A port (red) on the back panel 2 x USB 2.0/ 1.1 ports on the back panel Chipset+2 USB 3.2 Gen 1 Hubs: 6 x USB 3.2 Gen 1 ports (4 ports on the back panel, 2 ports available through the internal USB header) Chipset+1 USB 2.0 Hub: 4 x USB 2.0/ 1.1 ports available through the internal USB headers |
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| WARRANTY INFORMATION | ||
| Manufacturing Warranty | 3 Years | |
The B560 AORUS PRO AX comes with upgraded power solution, incredible cooling design, all PCIe 4.0 design and outstanding connectivity to elevate your gaming experience to the next level.
DIRECT POWER DESIGN
B560 AORUS motherboard uses an 12+1 phases digital CPU power design which includes both digital PWM Controller and DrMOS. These 100% digital controller and additional 8 Solid-pin CPU Power Connectors offer incredible precision in delivering power to the motherboard's most power-hungry and energy-sensitive components, allowing enthusiasts to get the absolute maximum performance from the new Intel 11th Gen CPU.
ADVANCED THERMAL SOLUTION
B560 AORUS uses high performance Fully Covered thermal design with high coverage MOSFET Heatsinks and thick thermal pad, providing ultimate MOSFET cooling performance for enthusiasts, over clockers and gamers.
PERFORMANCE
With the best quality components and GIGABYTE R&D design capability, the B560 AORUS is a true beast among motherboards.
NEXT GENERATION CONNECTIVITY
A high-end product needs to be future-proof so your system stays up-to-date with the latest technology. B560 AORUS PRO AX provides all next generation network, storage, and WIFI connectivity to keep you up to speed.
DEFINITIVE AESTHETICS
B560 AORUS PRO AX features RGB FUSION 2.0 and offers users the option to control onboard, external light strips, and/or AORUS devices with RGB / Addressable RGB LEDs to make their PC more unique and stylish.
ULTRA DURABLE
GIGABYTE is reputable for its product durability and high quality manufacturing process. Needless to say, we use the best components we can find for the B560 AORUS motherboard and reinforce every slot to make each of them solid and durable.
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